Selection of Solder Resist for Printed Circuit Board Printing and Troubleshooting of Common Faults 电路板印刷中阻焊油墨的选用和常见故障的处理
Development of a LTR-1 Type Thermosetting Solder Resist Ink for Printed Circuit Board 印刷电路板用热固阻焊油墨LTR-1的研制
Thickness Uniformity of Solder Resist for PCB 改善PCB阻焊膜厚度均匀性
This paper mainly introduce the productive technology on the surfce leveling and thickness uniformity of solder resist for PCB. 本文介绍了PCB表面平整化和阻焊膜(剂)厚度均匀性的生产技术。
The Development of Liquid Photo-imageable Solder Resist 液态光成像阻焊剂的发展动态
Three factors of inducing solder ball ( Minuteness solder ball remaining around weld spot in the course of refluence soldering) solder powders: oxidation extent, granularity and appending another element to resist oxidation weather or not were studied. 研究了焊粉导致焊料球(回流焊过程中残留在焊点周围的微小珠状焊料)产生的3个因素:氧化度、粒度以及焊粉中是否添加抗氧化元素。
Also, all the synthesized oligomers are capable of securing accuracy of pattern, and could be used in solder resist ink widely. 所有合成预聚物均可成清晰图像,在阻焊油墨中有广阔的应用前景。